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Lead Free Solder, Sn96.5% / Ag3% / Cu0.5%

Lead Free Solder, Sn96.5% / Ag3% / Cu0.5%

Lead free solder. Uses JEITA recommended alloys.

[Features]
· Features low-spatter flux.
· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

PDF

Japanese Only

Part Number

Configured Part Number is shown.

 
Part Number
HS301
HS317
HS-301
HS-302
HS-304
HS-312
HS-313
HS-314
HS-317
Part NumberMinimum order quantityVolume DiscountDays to ShipRoHSType Lead Free Wire diameter
(φ/mm)
Material Trusco Code Melting Point
(°C)
Flux
1 Piece(s) 1 Day(s) ---0.3-297-7605217 to 220°CJIS A class
1 Piece(s) 12 Day(s) ---1.0-298-4091217 to 220°CJIS A class
1 Piece(s) 1 Day(s) -Bobbin type MCorresponds to0.3Sn96.5%/Ag3%/Cu0.5%---
1 Piece(s) 1 Day(s) -Bobbin type MCorresponds to0.6Sn96.5%/Ag3%/Cu0.5%---
1 Piece(s) 16 Day(s) or more 10Bobbin type MCorresponds to1.0Sn96.5%/Ag3%/Cu0.5%---
1 Piece(s) 35 Day(s) -Bobbin type LCorresponds to0.6Sn96.5%/Ag3%/Cu0.5%---
1 Piece(s) 16 Day(s) or more 10Bobbin type LCorresponds to0.8Sn96.5%/Ag3%/Cu0.5%---
1 Piece(s) 35 Day(s) -Bobbin type LCorresponds to1.0Sn96.5%/Ag3%/Cu0.5%---
1 Piece(s) 12 Day(s) -Bobbin type LLCorresponds to1.0Sn96.5%/Ag3%/Cu0.5%---

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