Superiot RMA Noncleaning Solder

Standard Unit Price:

-

Days to Ship :

Same day or more

Non-washing type high performance solder containing flux, in which high reliability of the joining portion has been pursued.
[Features]
· Since the flux residue is completely non-corrosive, there is no need for washing the substrate after soldering.
· The residue has excellent non-conductivity and non-hygroscopicity, with no occurrence of age deterioration, and is optimal for high-density mounting substrates.
· Speeds up work with long sustainability of activity, an excellent spreading rate and excellent wettability of the solder.
· Uses organic amine-based special active rosin (non-chlorine based). JIS-AA class, MIL-RMA standard compliant.
[Applications]
· For copper and copper alloy precision substrates.

Basic Specifications

• Specifications

  • STOCK

• Lead-Free

  x

• Product Model

  Thread Solder (Stick Type)

• Flux (With Rosin)

  With

• Features

  The flux residue is completely non-corrosive, so it is unnecessary to clean the substrate after soldering. Residue has excellent non-conductivity and non-hygroscopic properties and are excellent for high density packaging without occurrence of aging defect. It has long-lasting activity and excellent spreading ratio, so faster work and solder wetting is possible. Organic amine type special active rosin (non-chlorine type) is used. JIS-AA class, MIL-RMA standard compliant.

• Use

  For copper / copper alloy precision substrate.

• Amount Of Content

  1 pc.