Mold Release Agent Low Viscosity Silicone Type

[Features]
•Contains low viscosity silicone, penetrates to any complicated places.
•Available for both thermoplastic resin and thermosetting resin.
•Hardly any weld line occur.
•Excellent in thermal stability (Heat resistance: 200~250°C)
[Applications]
•Used for thermoplastic resin, such as, PE, PP, PS, ABS, A S, PMMA, PC, nylon, polyacetal.
•Applies to thermosetting resin, such as, phenol, urea, melamine, epoxy, unsaturated polyester, etc.